Epson Electronics America Inc-Semiconductor Div Producten

S1D13513B00B200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 256BGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: -

package: 256-BGA

S2D13P04B00B100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 121TFBGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-PFBGA (10x10)

package: 121-TFBGA

S2D13513B01B100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR

• Type: -
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: -
• Supplier Device Package: -

package: -

S2D13513F01A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1D13748B00B10B

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 121BGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-PFBGA (10x10)

package: 121-TFBGA

S1D13T04F10E100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC EPD CTRLR 48SQFN

• Type: Graphic Controller
• Applications: EPD Panel
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: 48-SQFN (7x7)

package: -

S1D13700F02A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 64TQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: -

package: 64-TQFP

S1R72901F00A200

Epson Electronics America Inc-Semiconductor Div

IC PHY CONT 2PORT 1394A 100-QFP

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -
• Package / Case: 100-QFP
• Supplier Device Package: -

package: 100-QFP

S1R72C05B10E100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 121BGA

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 75mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-TFBGA (10x10)

package: 121-TFBGA

S1R72V27F14H100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 80QFP

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 40.2mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Supplier Device Package: 80-QFP (12x12)

package: 80-LQFP

S1C17704B102100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 161VFBGA

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 161-VFBGA
• Supplier Device Package: 161-VFBGA (7x7)

package: 161-VFBGA

S1C17W15F002100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 100QFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, POR, PWM, RFC, SNDA, WDT
• Number of I/O: 35
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP (14x14)

package: 100-LQFP

S1C17611D101000

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 48TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 19
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -25°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 48-TQFP
• Supplier Device Package: -

package: 48-TQFP

S1C17F57F401100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 128QFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 29
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 128-LQFP
• Supplier Device Package: -

package: 128-LQFP

S1V3G340F00A900-160

Epson Electronics America Inc-Semiconductor Div

VOICE GUIDANCE IC (ROMLESS)

• Function: Voice Processor
• Applications: Signal Mixing
• Number of Channels: 1
• Interface: SPI
• Voltage - Supply: 2.2 V ~ 5.5 V
• Operating Temperature: -
• Specifications: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-QFP13 (10x10)

package: 52-LQFP

S1C17W15F004100-119

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W18F102100-260

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 8K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W16F102100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 8KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17M12F101100-250

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 16.8MHZ16KB FLASH 2K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1D13515F00A100-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 64MB EXTERN

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-LQFP
• Supplier Device Package: 256-QFP22 (28x28)

package: 256-LQFP

S1D13748B00B100-240

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 1024KB S

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-PFBGA (10x10)

package: 121-TFBGA

S1D13705F00A200

Epson Electronics America Inc-Semiconductor Div

CONTROLLER LCD COLOUR

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17M40F701100-160

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 48KB FLASH 64QFP13

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.8MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: -
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-QFP13 (10x10)

package: -

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S1C17M20F002100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 32SQFN5

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: -
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-SQFN5 (5x5)

package: -

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S1C31D01B101000

Epson Electronics America Inc-Semiconductor Div

IC MCU 32BT 256KB FLSH 81VFBGA5H

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: 57
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 81-VFBGA
• Supplier Device Package: 81-VFBGA5H

package: -

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S1C17F63F101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 100QFP15

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.8MHz
• Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: 17
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 7x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

package: -

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S1C17M34F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 64TQFP13

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 17.12MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
• Number of I/O: 51
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 6x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP13 (10x10)

package: -

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S1S60000F00A300

Epson Electronics America Inc-Semiconductor Div

IC NETWORK CONTROLLER

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote