Epson Electronics America Inc-Semiconductor Div Producten

S1F77602Y0A000L

Epson Electronics America Inc-Semiconductor Div

IC BATTERY LEAK PREVENTION SOT89

• Function: -
• Battery Chemistry: -
• Number of Cells: -
• Fault Protection: -
• Interface: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: SOT-89-3

package: -

S2D13719F00A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 80LQFP

• Type: -
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 80-LQFP
• Supplier Device Package: 80-QFP (12x12)

package: 80-LQFP

S2D13515F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 256QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-LQFP
• Supplier Device Package: 256-QFP (28x28)

package: 256-LQFP

S1D13A04B00B200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 121PFBGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-BGA
• Supplier Device Package: -

package: 121-BGA

S1D13742F01A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 144QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-QFP (20x20)

package: 144-LQFP

S1D13701F00A100

Epson Electronics America Inc-Semiconductor Div

IC OLED CONTROLLER/MEMORY 64-QFP

• Type: -
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 64-QFP
• Supplier Device Package: -

package: 64-QFP

S1D13517F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128LQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Supplier Device Package: 128-QFP15 (16x16)

package: 128-LQFP

S1D13505F00A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128LQFP

• Type: Graphic Controller
• Applications: CRT, LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Supplier Device Package: 128-QFP15 (14x14)

package: 128-LQFP

S1R72U06F12E100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 48QFP

• Protocol: USB
• Function: Host Controller
• Interface: UART
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 30mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Supplier Device Package: 48-QFP (7x7)

package: 48-LQFP

S1R72U01F12E300

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 48QFP

• Protocol: USB
• Function: Host Controller
• Interface: UART
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 30mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Supplier Device Package: 48-QFP (7x7)

package: 48-LQFP

S1C17704F401100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 144TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 144-TQFP
• Supplier Device Package: -

package: 144-TQFP

S1C17M01F00C100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 64TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.3MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: AMRC, LCD, PWM, RFC, WDT
• Number of I/O: 19
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: -

package: 64-TQFP

S1V3S344A00A800-160

Epson Electronics America Inc-Semiconductor Div

VOICE GUIDANCE IC (FLASH)

• Function: Voice Processor
• Applications: Signal Processing
• Number of Channels: 1
• Interface: SPI
• Voltage - Supply: 3.3 V ~ 5 V
• Operating Temperature: -
• Specifications: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-QFP13 (10x10)

package: 52-LQFP

S1C17W15F002100-90

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W15F003100-260

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W03F101100-250

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ16KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W13F002100-260

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W13F002100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1D13A05B00B200-240

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 256KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-PFBGA (10x10)

package: 121-TFBGA

S1D13742F01A200-60

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 768KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-QFP20 (20x20)

package: 144-LQFP

S1D13705F00A200-119

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 80KB SRA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 80-LQFP
• Supplier Device Package: 80-QFP14 (12x12)

package: 80-LQFP

S1D13717F00A200-40

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 224KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP
• Supplier Device Package: 176-QFP21 (24x24)

package: 176-LQFP

S1C17M23F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 24SQFN4

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: -
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-SQFN4 (4x4)

package: -

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S1C17M31F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 48KB FLASH 48TQFP12

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 17.12MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
• Number of I/O: 37
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 3x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP12 (7x7)

package: -

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S1C17M31F001100-250

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 48KB FLASH 48TQFP12

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 17.12MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
• Number of I/O: 37
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 3x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP12 (7x7)

package: -

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S1C17M23F001100-490

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 24SQFN4

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: -
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-SQFN4 (4x4)

package: -

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S1C17M33F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 96KB FLASH 80TQFP14

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 17.12MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
• Number of I/O: 65
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 6x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP14 (12x12)

package: -

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S1C31D01D101000

Epson Electronics America Inc-Semiconductor Div

IC MCU 32BIT 256KB FLASH CHIP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: 57
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

package: -

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