Epson Electronics America Inc-Semiconductor Div Producten

S1D15722D01B000

Epson Electronics America Inc-Semiconductor Div

IC DRIVER LCD

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1D13515F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 256LBGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-LQFP
• Supplier Device Package: 256-QFP (28x28)

package: 256-LQFP

S1D13705F00A20B

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 80QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 80-LQFP
• Supplier Device Package: 80-QFP (12x12)

package: 80-LQFP

S1D15710D11B000

Epson Electronics America Inc-Semiconductor Div

IC DRIVER LCD

• Type: Display Driver
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

package: Die

S1D13746B01B600

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100BGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-PFBGA (7x7)

package: 100-TFBGA

S1D13719F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 208QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-QFP (28x28)

package: 208-LQFP

S1D13A05B00B200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 121PFBGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-BGA
• Supplier Device Package: -

package: 121-BGA

S1D13506F00A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128LQFP

• Type: -
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 128-QFP
• Supplier Device Package: -

package: 128-QFP

S1R72805F00A2

Epson Electronics America Inc-Semiconductor Div

IC LINK CTRLR 1394 IDE100 100QFP

• Applications: -
• Interface: IEEE 1394/USB
• Voltage - Supply: 3.3V
• Package / Case: 100-QFP
• Supplier Device Package: -
• Mounting Type: Surface Mount

package: 100-QFP

S1C17W22D00B000

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH DIE

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, RFC, WDT
• Number of I/O: 41
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: -

package: Die

S1C17704B403100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 144VFBGA

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 144-VFBGA
• Supplier Device Package: -

package: 144-VFBGA

S1C17602F101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 100TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -25°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: -

package: 100-TQFP

S1V3S344A00A800

Epson Electronics America Inc-Semiconductor Div

OSC TEXT TO SPEECH LSI 52QFP

• Function: Voice Processor
• Applications: Signal Processing
• Number of Channels: 1
• Interface: SPI
• Voltage - Supply: 3.3V, 5V
• Operating Temperature: -
• Specifications: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-QFP (10x10)

package: 52-LQFP

S1V30120F01A100

Epson Electronics America Inc-Semiconductor Div

OSC TEXT TO SPEECH LSI 64QFP

• Function: Voice Processor
• Applications: Signal Mixing
• Number of Channels: 1
• Interface: SPI
• Voltage - Supply: 1.65 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Specifications: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

package: 64-TQFP

S1V30080F01A000

Epson Electronics America Inc-Semiconductor Div

OSC TEXT TO SPEECH LSI 48QFP

• Function: Voice Processor
• Applications: Signal Mixing
• Number of Channels: 1
• Interface: I2C, SPI
• Voltage - Supply: 2.2 V ~ 5.5 V
• Operating Temperature: -
• Specifications: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-QFP (7x7)

package: 48-LQFP

E91E600A11

Epson Electronics America Inc-Semiconductor Div

ACCELEROMETER

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: Module
• Supplier Device Package: -

package: Module

S1V30080F0*A*00

Epson Electronics America Inc-Semiconductor Div

MELODY & VOICE IC

• Function: Voice Processor
• Applications: Signal Mixing
• Number of Channels: 1
• Interface: I²C, SPI
• Voltage - Supply: 2.2 V ~ 5.5 V
• Operating Temperature: -
• Specifications: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-QFP12 (7x7)

package: 48-LQFP

S1C17W35F001100-40

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 256KB FLASH 12

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W03F102100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ16KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S2D13719F00A200-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER FOR AUTOMOTIVE UP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-QFP22 (28x28)

package: 208-LQFP

S2D13513B01B100-119

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER FOR AUTOMOTIVE UP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-PBGA (17x17)

package: 256-LBGA

S1D13719B00B100-240

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 512KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-PFBGA (10x10)

package: 180-TFBGA

S1D13706F00A200-90

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 80KB SRA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

package: 100-LQFP

S1D13513B01B100-85

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 64MB EXTERN

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-PBGA (17x17)

package: 256-LBGA

S1D13L03F00A100-40

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 768KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP
• Supplier Device Package: 176-QFP21 (24x24)

package: 176-LQFP

S1C17M40F702100-250

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 48KB FLASH 48TQFP12

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.8MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: -
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP12 (7x7)

package: -

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S1C17M23F002100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 32SQFN5

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: -
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-SQFN5 (5x5)

package: -

Request a Quote

S1C17M23F002100-490

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 32SQFN5

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: -
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-SQFN5 (5x5)

package: -

Request a Quote