Epson Electronics America Inc-Semiconductor Div Producten

S1F75540F5A0000

Epson Electronics America Inc-Semiconductor Div

IC DC/DC CONV W/VOLT REG 64-QFN

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 64-QFN
• Supplier Device Package: -

package: 64-QFN

S1F77603Y0A000L

Epson Electronics America Inc-Semiconductor Div

IC BATTERY LEAK PREVENTION SOT89

• Function: -
• Battery Chemistry: -
• Number of Cells: -
• Fault Protection: -
• Interface: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: SOT-89-3

package: -

S1D13709F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 80TQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP (12x12)

package: 80-TQFP

S2D13782F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100BFQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-BFQFP
• Supplier Device Package: 100-QFP (14x14)

package: 100-BFQFP

S1D13L01F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Supplier Device Package: 128-QFP (14x14)

package: 128-LQFP

S1D13706F00A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100TQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP

package: 100-TQFP

S1D13781F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100LQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

package: 100-LQFP

S1R72C05B08E100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 121BGA

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 75mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-TFBGA (8x8)

package: 121-TFBGA

S1R72C05F15E100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 128QFP

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 75mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 128-LQFP
• Supplier Device Package: 128-LQFP (14x14)

package: 128-LQFP

S1C17W22F00B100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 128TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, RFC, WDT
• Number of I/O: 41
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 128-TQFP
• Supplier Device Package: -

package: 128-TQFP

S1C17704F101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 144TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 144-TQFP
• Supplier Device Package: -

package: 144-TQFP

S1C17W22F101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 128TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, RFC, WDT
• Number of I/O: 41
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP (14x14)

package: 128-TQFP

S1C17W22D101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH DIE

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, RFC, WDT
• Number of I/O: 41
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: Die

package: Die

S1V3G340F00A900

Epson Electronics America Inc-Semiconductor Div

OSC TEXT TO SPEECH LSI 52QFP

• Function: Voice Processor
• Applications: Signal Mixing
• Number of Channels: 1
• Interface: SPI
• Voltage - Supply: 2.2 V ~ 5.5 V
• Operating Temperature: -
• Specifications: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-QFP (10x10)

package: 52-LQFP

S7U4E0020030000

Epson Electronics America Inc-Semiconductor Div

MICRO GPS EVALUATION MODULE

• Type: GPS Receiver
• Frequency: 1575MHz
• For Use With/Related Products: -
• Supplied Contents: Module

package: -

S1C31W74B201000-348

Epson Electronics America Inc-Semiconductor Div

32BIT-MCU ARM CORETEX M0+ 21.7MH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W15F005100-160

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W15F004100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W13F001100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17M10F101100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 16MHZ 64KB FLASH 4K R

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S2D13515F00A100-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER FOR AUTOMOTIVE UP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-LQFP
• Supplier Device Package: 256-QFP22 (28x28)

package: 256-LQFP

S1D13513F01A100-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB EXTERN

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-QFP22 (28x28)

package: 208-LQFP

S1D13709F00A100-119

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 32KB SRA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP14 (12x12)

package: 80-TQFP

S1D13517F00A100-90

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB SDRAM

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Supplier Device Package: 128-QFP15 (14x14)

package: 128-LQFP

S1C17F63F101100-90

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 100QFP15

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.8MHz
• Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: 17
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 7x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

package: -

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S1C17M25F001100-250

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 48TQFP12

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: 39
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP12 (7x7)

package: -

Request a Quote

S1C17M22F001100-250

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 48TQFP12

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: 39
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP12 (7x7)

package: -

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S1S60000F00A500

Epson Electronics America Inc-Semiconductor Div

IC NETWORK CONTROLLER

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote